LED Parts Tungsten Copper Alloy Heat Bases Thickness 0.1mm to 2.0mm Customized

Tungsten copper alloy is used extensively in thermal mounting plates, heat bases, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized. 

The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper’s thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.

The thermal conductivity and thermal expansion characteristics of the semiconductor and the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation. The sketch shows the principle structure of a hermetically sealed electronic package.

Applicatioins of Tungsten Copper Alloy:

 
Specifications of WCu Alloys:

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